【摘要】 采用热等静压(HIP)技术制备50Sip/Al-Cu和70Sip/Al-Cu复合材料(50Sip/Al-4.0Cu和70Sip/Al-4.0Cu,Si含量为体积分数,Cu的质量分数为4.0%),利用XRD和扫描电镜研究热等静压态样品的相组成和组织形貌,并测试其主要物理和力学性能。结果表明:材料完全致密、Si颗粒在Al基体中分布均匀且组织细小;热等静压态的50Sip/Al-Cu和70Sip/Al-Cu复合材料的热膨胀系数分别为12.7×10 6和8.7×10 6K 1,抗弯强度分别为395和350MPa,热处理后的材料强度拉弯可进一步提高至548和397 MPa,与采用其他技术制备的同类材料相比,热等静压制备的Sip/Al-Cu复合材料在保持低膨胀系数的同时具有更高的抗弯强度及其他力学性能。更多还原

【Abstract】 The Al alloy matrix composites reinforced by silicon particles(50% and 70%Sip /Al-4.0Cu,Si content in volume fraction and Cu content of 4% in mass fraction) were prepared by hot-isostatic pressing(HIP).The microstructure of the composites was investigated by XRD and scanning electron microscopy.The mechanical and thermal properties of the composites were tested.The results show that the prepared Si/Al-Cu composites are fully dense.The silicon particles well distribute in Al matrix.The coefficients of thermal expansion(CTE) of as-HIPed 50Sip/Al-Cu and 70Sip /Al-Cu composites are 12.7×10-6 and 8.7×10-6 K-1.The three-point bending of the as-HIPed 50Si p /Al-Cu and 70Si p /Al-Cu composites are 395 and 350MPa,which can be improved to 548 and 397MPa through the heat treatment.The Sip/Al-Cu composites prepared by the hot isostatic pressing route show remarkably enhanced strength,especially keep low coefficient of thermal expansion and low density compared with the similar materials prepared by other methods.更多还原