【摘要】 本文以高银钎料SAC305为对比,研究了低银SAC-Bi-Ni钎料分别与Cu和Ni焊盘形成的焊点抗热冲击及抗热时效性能。结果表明:热冲击前后SAC-Bi-Ni体钎料的硬度均比SAC305高。随着热冲击次数的增加,界面IMC层逐渐变厚,低银钎料SAC-Bi-Ni/Cu界面IMC层的厚度比高银钎料SAC305/Cu薄;热时效前后,SAC-Bi-Ni焊点的抗剪切强度均大于SAC305焊点。更多还原

【Abstract】 In this paper,the thermal shock and thermal aging resisitance of low silver SAC-Bi-Ni solder joints on Cu and Ni subtrates were investigated respectively compared with SAC305,the high silver solder.Experimental results revealed that the hardness of SAC-Bi-Ni was higher than that of SAC305 before and after thermal shock.With the increase of the number of times of the thermal shock,the thickness of the IMC layer increased gradually,Meanwhile,the thickness of the IMC layer of low silver SAC-Bi-Ni / Cu was thiner than that of high silver SAC305 / Cu;SAC-Bi-Ni of solder joint showed higher shear strength than SAC305 before and after thermal aging.更多还原