Water-quenching technique was used to evaluate the thermal shock behavior of the SiC-SiC joints joined with Na 2 O-B 2 O 3-SiO 2 glass solder.The microstructure of the side view of the interface and the fracture surface of the joints after quenching were analyzed.The influence of the quenching temperature and quenching cycles from 150℃ to cool water on the residual strength of the specimens were investigated.At the quenching temperature of 150℃,the residual strength of the joint decreased to(152±28) MPa due...
【基金】
国家自然科学基金(50990301,51072210)~~
【更新日期】
2012-03-27
【分类号】
TQ174.1
【正文快照】
the joints after quenching were analyzed.The influence of the quenching temperature and quenching cycles from150℃to cool water on the residual strength of the specimens were investigated.At the quenching temperature of150℃,the residual strength of the j
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