【摘要】 研究了DK110树脂在HAc-NaAc缓冲体系中对铜离子的吸附及解吸的行为,在pH=5.39时吸附最佳。静态饱和吸附容量为332 mg/g(树脂,用0.3 mol/L HCl可定量洗脱;测得吸附速率常数k298=1.03×10-4s-1,表观活化能Ea=6.96 kJ/mol;吸附服从Freundlich经验式;热力学参数ΔH=10.4 kJ/mol。用化学和红外光谱等方法探讨了吸附机理。更多还原

【Abstract】 The adsorption behavior of DK110 Resin or Cu(Ⅱ) is investigated.DK110 resin has a good adsorption ability for Cu(Ⅱ) in the HAc-NaAc medium at pH=5.39.The statically saturated sorption capacity is 332 mg/g resin.Cu(Ⅱ) adsorbed on DK110 can be eluted quantitatively by using 0.3 mol/L hydrochloric acid as an eluant.The apparent rate constant and activation energy are k 298 =1.03×10-4 s-1 and Ea=6.96 kJ/mol.The adsorption behavior of DK110 resin for Cu(Ⅱ) obeys the Freundlich isotherm.The adsorption thermodynamic parameters of DK110 for Cu(Ⅱ) are enthalpy change ΔH=10.4 kJ/mol.The adsorption mechanism of DK110 for Cu(II) was confirmed by chemical analysis and IR spectrometry.更多还原