【摘要】 寻求SMT片式电阻的焊点特征信息(焊点的面积、周长和边界等)的提取、检测、分析方法,是有效地控制表面组装质量和可靠性的关键,同时为焊点形态的三维重建和形态恢复提供准确的数据来源;以1206的SMT片式电阻焊点为研究对象,提出一种以虚拟仪器开发的计算机视觉检测技术为平台、结合图像处理技术和Matlab软件来完成对预处理后的SMT焊点检测、分析的方法;实验表明,该方法测量结果准确,效率高,扩展性强,进行其它元器件焊点的检测和恢复时,不需要额外添加硬件,降低开发成本。更多还原

【Abstract】 The methods of pursuing the information feature extraction,detection and analysis of SMT solder joints is the key to the SMT quality and reliability,can provide data about three-dimensional reconstruction and morphological recovery of SMT solder joints.In this paper,the shape parameters of 1206 SMT solder joints is detected,analyzed and restored through the use of image processing and Matlab based on the theory and technology of computer vision and Virtual Instrument.Experiments show that the method is of high efficiency and strong expansibility,the results are accurate and the cost is reduced.更多还原