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光伏靶材氧化锌与铜基板的非铟连接

Indium-free soldering between photovoltaic ZnO target and copper

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【作者】 李英董淑娟黄艳卢志云谢明贵

【Author】 LI Ying1,2,DONG Shu-juan3,HUANG Yan1,LU Zhi-yun1,XIE Ming-gui1(1.College of Chemistry,Sichuan University,Chengdu 610064,Sichuan pro.,China;2.College of Chemical Engineering,Sichuan University,Chengdu 610064,Sichuan pro.,China;3.China Yaohua Glass Group Corporation,Qinhuangdao 066004,Hebei pro.,China)

【机构】 四川大学化学学院四川大学化学工程学院中国耀华玻璃集团

【摘要】 目前,光伏ZnO靶材与铜基板的连接主要依靠价格昂贵的金属铟。本文分别以贵金属钯、贵金属银、胶体铜为活化液,以甲醛、多聚甲醛、次亚磷酸钠等为镀液还原剂,研究了光伏ZnO靶材的化学镀铜条件,实现了其表面化学镀铜,进而利用普通的价格低廉的钎料SnAg0.3Cu0.7,SnBiAg成功实现了靶材与铜基板的连接。该工艺操作简单,耗费小,在大规模的工业生产中具有广泛的应用前景。

【Abstract】 In this paper,these were studied that electroless copper plating conditions of photovoltaic ZnO target as substrate,using noble metal palladium,noble metals silver,colloidal copper as activators,and formaldehyde,paraformaldehyde,sodium hypophosphite as reducing agents.The solder connected copper and photovoltaic ZnO target after electroless copper plating could use the ordinary solder(SnAg0.3Cu0.7,SnBiAg,RMB 200~400 yuan/kg)in place of noble metal indium(about RMB 4 300 yuan/kg).It would have broad application prospects in large-scale industrial production because of its low cost and simple process.

【关键词】 ZnO焊接化学镀铜
【Key words】 ZnOsolderingelectroless copper plating
  • 【文献出处】 焊接技术 ,Welding Technology , 编辑部邮箱 ,2012年04期
  • 【分类号】TQ153.14
  • 【被引频次】2
  • 【下载频次】123
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