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电子学设备热真空/热平衡试验一体化技术

Integration Technology of Thermal Vacuum Test and Thermal Balance Test for Electronic Equipment

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【作者】 陈维春

【Author】 CHEN Weichun (Beijing Institute of Space Mechanics & Electricity,Beijing 100076,China)

【机构】 北京空间机电研究所

【摘要】 航天遥感相机电子学设备在研制过程中需要进行热真空试验与热平衡试验。电子学设备热真空试验与热平衡试验的一体化技术能够更为合理地组织热试验进程并进一步提高研制效率。为了研究两种热试验一体化技术的可实现性,文章分析了两种热试验的内在联系,提出了采用一套热边界模拟装置在一次试验中先后完成两种热试验的试验方法。在此基础上,文章以某项目电子学设备为仿真实例,重点分析了热平衡试验的可实现性,从而验证了一体化技术的正确性。

【Abstract】 Thermal vacuum test and thermal balance test of electronic equipment for space remote sensor are performed during development.In this paper an integration technology of thermal vacuum test and thermal balance test for electronic equipment is presented.The thermal balance test can be arranged reasonably and the development efficiency be inproved.The inherent relationship between the two thermal tests is analyzed deeply,and a test method is proposed that the two thermal tests are conducted at a time by using a set of thermal boundary simulation device,in order to research the realization of integration of the two thermal tests.Subsequently,the feasibility of realization of thermal balance test is analyzed,and the integration technology is validated by taking an electronic equipment as an example.

  • 【文献出处】 航天返回与遥感 ,Spacecraft Recovery & Remote Sensing , 编辑部邮箱 ,2012年05期
  • 【分类号】V416.5
  • 【被引频次】4
  • 【下载频次】112
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