【摘要】 本文研究了Ni-Cu扩散偶界面元素的互扩散行为。对热压扩散连接法制备的Cu-Ni-Cu扩散偶进行退火处理,采用电子探针显微成分分析仪观察扩散偶界面互扩散区的微观组织特征,结合Boltzmann-Matano法研究扩散区内元素的互扩散行为。结果表明:在扩散偶界面处Cu原子的扩散通量远大于Ni原子的扩散通量,互扩散区内Ni原子的距离-浓度曲线关于Matano面不对称,暗示互扩散系数与Ni原子的浓度有关。在每一种退火温度下,互扩散系数均随互扩散区α固溶体中Ni原子分数的增加而单调增大,并且随α固溶体中Ni原子分数的增加,频率因子和互扩散激活能均单调增大。更多还原

【Abstract】 In this study,the interfacial element interdiffusion of Ni-Cu diffusion couple was investigated.Cu-Ni-Cu diffusion couples prepared by hot press diffusion bonding technique were annealed at various experimental conditions.The interfacial structure of interdiffusion zone of diffusion couples was observed by means of electron probe micro-analysis(EPMA),and the interdiffusion of Ni-Cu system was analyzed combining with the Boltzmann-Matano method.The results show that the diffusion flux of Cu atom across the interface into the Ni phase is far greater than that of Ni atom into the Cu phase.The distance-concentration profiles of Ni atom are nonsymmetrical with respect to the Matano plane,which suggest that the interdiffusion coefficients are related to the concentration of Ni atom in the interdiffusion zone.Under each heat treatment condition,all the interdiffusion coefficients increase monotonically with increasing Ni content in the α solid solution for the interdiffusion zone.Furthermore,with the increase of Ni content in the α solid solution,the frequency factors and activity energies for the interdiffusion also increase monotonically.更多还原