【摘要】 研究了以B2O3、SiO2、Bi2O3、ZnO、Al2O3为基础成分,以BaO、MgO、Na2O等多种氧化物为辅助成分替代银电子浆料粘结相中的PbO。根据银电子浆料的不同用途,研究分析了BaO、MgO、Na2O等助熔剂对玻璃体系软化温度(Tg)和热膨胀系数(α)的影响。研制出了中、低温银浆用的Tg为420℃、α为11.8×10-6℃和高温银浆用的Tg为700℃、α为1.9×10-6℃的2种无铅玻璃。用该玻璃制备出的银电子浆料电性能优良,能满足特定电极的应用要求。更多还原

【Abstract】 A kind of lead-free glass for silver electronic paste composed of B2O3,SiO2,Bi2O3,ZnO and Al2O3 as base components and BaO,MgO and Na2O as co-components was studied to substitute for PbO glass system.According to the different uses,the influences of the contents of BaO,MgO and Na2O on the softening temperature(Tg) and thermal expansion coefficient(α) were analyzed and discussed.Two kinds of lead-free glass with softening temperature of 420℃,thermal expansion coefficient of 11.8 × 10-6 ℃ and softening temperature of 700℃,thermal expansion coefficient of 1.9 × 10-6 ℃ were developed.The electrical properties of the silver paste are good.It shows that this lead-free glass can meet the requirements of specific electrode.更多还原