【摘要】 随着微电子工业的快速发展,为了提高大规模集成电路中芯片间的传输速度以满足高集成化的要求,需要层间绝缘材料具有较低的介电常数。聚酰亚胺已被广泛用于大规模集成电路的层间绝缘材料,降低其介电常数的研究在近年来受到了广泛关注。当采用化学方法降低介电常数时,调控聚酰亚胺的分子结构是基础;在聚酰亚胺中构建多孔结构则是进一步降低介电常数的有效手段。本文从调控分子结构和构建多孔结构的角度出发,综述了化学法制备低介电常数聚酰亚胺的研究进展,并对低介电常数聚酰亚胺的研究前景进行了展望。更多还原

【Abstract】 With the rapid development of the microelectronics industry,the insulating interlayer material with low dielectric constant is urgently needed in order to improve the speed of transmission between the chips of large scale integrated circuit and meet the requirement of high integration.Polyimide is widely used as the insulating interlayer material in large scale integrated circuit.Reducing dielectric constant of polyimide has attracted much research attention in recent years.When using chemical methods to reduce the dielectric constant,modifying the molecular structures of polyimide is a basic approach.On the other hand,building the porous structure in materials is an effective way to further reduce the dielectric constant of polyimide.In this paper,the recent developments in modifying the molecular structure and building the porous structure are reviewed.Preparation methods of polyimide with low dielectric constant by both methods are summarized and the research prospects in this area are predicted.更多还原