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耐高温交联侧基苯乙炔封端酰亚胺预聚体
Phenylethynyl-terminated Imide Oligomer of Having Pendent Phenylethynyl Group with Good Thermal Stability
【摘要】 合成了含有苯乙炔基的二胺单体3,5-二氨基-4’-苯乙炔苯甲酮(DPEB),并与3,3’,4,4’-联苯四酸二酐(s-BPDA)和1,4-双(4’-氨基苯氧基)-2-(苯基)苯(p-TPEQ)进行了缩聚反应,以4-苯乙炔苯酐作为封端剂,合成了交联侧基苯乙炔封端酰亚胺预聚体(n=4).DSC测试结果表明,引入交联侧基后预聚体依然保持着较宽的加工窗口.利用所合成的预聚体在370℃热压1 h制备了热固性薄膜.DMA测试结果表明,引入交联侧基的预聚体树脂具有更高的玻璃化转变温度,并且其储存模量在玻璃化转变后有很好的保持.
【Abstract】 A diamine monomer 3,5-diamino-4′-phenylethynylbenzophenone(DPEB) was synthesized and phenylethynyl-terminated imide oligomers having pendent phenylethynyl group(n=4) was prepared by the reaction of 3,3′,4,4′-biphenylenetetracarboxylic dianhydride(s-BPDA),DPEB and 2,5-bis(4-aminophenoxy)-biphenyl(p-TPEQ),and end-capped with 4-phenylethynylphthalic anhydride(PEPA).The imide oligomer had low Tg and provided wide processing window.The cured films were prepared by molding the oligomer powder at 370 ℃ for 1 h under pressure.DMA results show the introduction of pendent phenylethynyl group increases Tg of the cured film and the retention of storage modulus beyond Tg is promoted.
【Key words】 Polyimide; Oligomer; Cross-linked pendent group; Phenylethyne; 3,5-Diamino-4′-phenyl ethynylbenzophenone(DPEB);
- 【文献出处】 高等学校化学学报 ,Chemical Journal of Chinese Universities , 编辑部邮箱 ,2012年09期
- 【分类号】O631.3
- 【被引频次】5
- 【下载频次】213