【摘要】 以化学还原法合成的银包玻珠核壳复合粒子(Ag/GM)为原料,乙二胺为表面处理剂,制备了表面吸附有乙二胺的Ag/GM,并用它作为导电填料组成了导电胶.与化学还原法直接合成或沸水处理的Ag/GM相比,乙二胺处理的Ag/GM能更有效地分散在环氧树脂胶黏剂中,且能与环氧树脂基体产生化学键合,降低Ag/GM和环氧树脂基体间的界面能,用其制备的导电胶的导电率较高,导电渗滤阈值较低.同时,结合导电网络理论和等效电路图,阐明了用乙二胺处理的Ag/GM作填料制备的导电胶具有较低体积电阻率的原因.更多还原

【Abstract】 Using silver coated glass microsphere composite particles(Ag/GM) synthesized by liquid chemical reduction method as raw materials,and ethylenediamine as surface modification agents,Ag/GM with ethylenediamine on their surface were prepared and used as conductive fillers to fabricate electrically conductive adhesive.Compared with the Ag/GM synthesized by chemical reduction method and modified with boiling water,the Ag/GM modified with ethylenediamine are dispersed in the epoxy adhesive more effectively and the interface energy between them and epoxy resin matrix is reduced because of the formation of the chemical bonding between the epoxy resin and the ethylenediamine adsorbed on the surface of Ag/GM.The as-fabricated electrically conductive adhesives show a relative high conductivity and low conductive percolation threshold,which is reasonably explained by the conductive percolation theory and equivalent circuit diagram.The result provides a simple and effective way to improve the conductivity of electrically conductive adhesive.更多还原