【摘要】 半导体器件的片内偏差是影响芯片性能的主要因素之一,片内偏差具有空间相关性.随着工艺尺寸的持续缩小,片内偏差空间相关性日益复杂,传统方法采用的参数化方法难以正确描述相应的相关函数;同时研究发现片内偏差空间相关性在不同方向上有不同的表现,即各向异性.为提高片内偏差空间相关性建模的准确性,提出一种非参数化的估计方法,使用B样条函数作为相关函数的基函数进行拟合,并与多项式拟合的方法进行比较,实验结果显示该方法能更好地符合统计特性.更多还原

【Abstract】 The intra-die variation of semiconductor devices has become one of the most dominant factors affecting chip performance,intra-die variation shows spatial correlation.As feature size decrease continues,the spatial correlation of intra-die variation becomes more and more complicated.The traditional parametric methods are hard to accurately describe the corresponding correlation function;also the spatial correlation of intra-die variation is anisotropic.To improve the modeling accuracy of the spatial correlation of intra-die variation,a non-parametric estimation method is presented,using B-spline as the basis function of the correlation function.Compared with polynomial fitting method,the experimental result shows the proposed method fits the statistical properties better.更多还原