【摘要】 通过开展无铅波峰焊正交试验,以大量的试验数据为依据确定了无铅电子组装工艺参数,建立了无铅波峰焊工艺参数间的关系模型,考察了不同试验因素的组合对焊点缺陷率的影响,对工艺参数进行了优化,并得到了各因素对实验结果重要性的影响顺序及优化的参数结果。更多还原

【Abstract】 An orthogonal experiment of lead-free wave soldering was conducted,then the process parameters of the lead-free electronic assembly were confirmed on the basis of a large number of experimental data,the model of the relationship between the lead-free wave soldering process parameters was established,the influence of solder defect rate by combined collocation ( interaction) between the experimental factors was investigated,the process parameters were optimized. Optimized parameters results and the order of importance of various factors on the experimental results were obtained.更多还原