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全耗尽SOI MOSFET自加热效应的模拟研究
The Simulation and Study of Self-heating Effects in Fully Depleted SOI MOSFETs
【摘要】 利用Silvaco软件模拟全耗尽SOI n沟道MOSFET器件的自加热效应。在温度300~500K、栅偏压2~10V范围内研究了该器件的ID-VD特性和器件的温度分布规律。在低温和高栅偏压时,SOI结构中自加热效应明显。此现象归因于低温和高栅偏压时,SOI n-MOSFET中的漏电流密度大,热载流子使晶格升温迅速。
【Abstract】 In this paper,the self-heating effects in the fully depleted enhancement SOI n-MOSFET are investigated over a temperature range from 300 to 500K and a gate voltage range of 2-10V.The drain current-drain voltage characteristics(ID-VD) have been studied extensively.It has been noted that the self-heating effects reduced at a higher temperature and lower gate biases.The present study is important for the design and application of SOI devices.
【基金】 国家自然科学基金项目(10804094);秦皇岛市科技研究与发展计划(201101A104)
- 【文献出处】 重庆科技学院学报(自然科学版) ,Journal of Chongqing University of Science and Technology(Natural Sciences Edition) , 编辑部邮箱 ,2012年06期
- 【分类号】TN386
- 【下载频次】194