节点文献
低银Sn-Ag-Cu-Bi-Er焊料及其焊点的拉伸性能研究
Study on Sn-Ag-Cu-Bi-Er Solder with Low-Silver Content and Tensile Properties of the Solder Joints
【摘要】 采用差热分析、润湿性和力学性能试验研究了自主研发的一种新型低银无铅焊料Sn-XAg-0.3Cu-3Bi-0.05Er(SACBE)(X=1.0,1.5,2.0)及其焊点的拉伸性能。结果显示,与Sn-3.0Ag-0.5Cu(SAC)焊料相比,SACBE焊料具有较低的起始熔化温度(204～206℃)和较好的润湿性。Cu/SACBE/Cu焊点的拉伸强度与Cu/SAC/Cu焊点相当,但是其韧性显著改善。表明新型低银SACBE焊料,在保持SAC焊料优良物理力学性能基础上所具有的成本优势。
【Abstract】 The fusion characteristics,wettabilities and mechanical properties of the new low-silver lead-free solder Sn-XAg-0.3Cu-3Bi-0.05Er(SACBE)(X=1.0,1.5,2.0) were studied by DSC,wettability experiment and tensile test.The results show that the developed SACBE solder has better properties in comparison with commercial Sn-3.0Ag-0.5Cu(SAC) solder,featuring a lower melting temperature,a better wetting performance and excellent toughness.It implies that the developed SACBE solder is a potential one for electronic packaging production.
【Key words】 low-silver； SACBE； SAC； melting temperature； wettability；
- 【文献出处】 稀有金属材料与工程 ,Rare Metal Materials and Engineering , 编辑部邮箱 ,2012年S2期
- 【分类号】TG425
- 【被引频次】3
- 【下载频次】216