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氧化铝陶瓷的Mo-Mn-Ti-Si-Al系统膏剂金属化工艺研究

Processing of Metallizing Alumina Ceramic with Mo-Mn-Ti-Si-Al System Paint

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【作者】 荀燕红张巨先陈丽梅高陇桥

【Author】 XUN Yan-hong1,ZHANG Ju-xian1,2,CHEN Li-mei1,GAO Long-qiao1(1.Beijing Vacuum Electronics Research Institute,Beijing 100015,China; 2.Vacuum Electronics National Lab,Beijing 100015,China)

【机构】 北京真空电子技术研究所大功率微波电真空器件技术国防科技重点实验室

【摘要】 用Mo-Mn-Ti-Si-Al系统膏剂金属化两种氧化铝陶瓷材料。封接强度实验结果表明,Mo-Mn-Ti-Si-Al系统膏剂不适宜高纯Al2O3陶瓷的金属化封接,而比较适宜95%Al2O3陶瓷的金属化封接。用该膏剂金属化95%Al2O3陶瓷,其焊接强度最高值可达150MPa以上。通过显微结构分析发现,高纯Al2O3陶瓷的金属化机理与95%Al2O3陶瓷金属化的机理不同,前者中玻璃相仅仅通过高温熔解-沉析与表面的Al2O3晶粒反应,后者金属化层内玻璃相与陶瓷内玻璃相相互迁移渗透。

【Abstract】 Two kind of alumina ceramics were metallized by Mo-Mn-Ti-Si-Al system paint.The results of sealing strength indicated that Mo-Mn-Ti-Si-Al system paint was fit for 95% Al2O3 ceramic,but it was not fit for high pure alumina ceramics.And strength of metal-95% Al2O3 ceramic seals reached above 150MPa.By analyzing the microstructure of metal-alumina ceramics seal section,the metallizing mechanism of high pure alumina ceramics was different from that of 95% Al2O3 ceramic.The former was that glassy phase in metallizing layer was reaction with Al2O3 grains on the surface of ceramic.The latter was that glassy phase in metallizing layer migrated to ceramics,and glassy phase in ceramics migrated to metallizing layer.

  • 【文献出处】 真空电子技术 ,Vacuum Electronics , 编辑部邮箱 ,2011年01期
  • 【分类号】TQ174.1
  • 【被引频次】12
  • 【下载频次】355
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