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AlGaInP-Si glue bonded high performance light emitting diodes

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【作者】 陈依新沈光地郭伟玲高志远

【Author】 Chen Yi-Xin,Shen Guang-Di,Guo Wei-Ling,and Gao Zhi-Yuan Beijing Optoelectronic Technology Laboratory,Beijing University of Technology,Beijing 100124,China

【机构】 Beijing Optoelectronic Technology Laboratory,Beijing University of Technology

【摘要】 We propose a new method of using conductive glue to agglutinate GaAs based AlGaInP light emitting diodes (LEDs) onto silicon substrate,and the absorbing GaAs layer is subsequently removed by grinding and selective wet etching.It was found that AlGaInP-Si glue agglutinated LEDs have larger saturation current and luminous intensity than the conventional LEDs working at the same injected current.The luminous intensity of the new device is as much as 1007.4 mcd at a saturation current of 125 mA without being encapsulated,while the conventional LEDs only have 266.2 mcd at a saturation current of 105 mA.The luminescence intensity is also found to increase by about 3.2% after working at 50 mA for 768 h.This means that the new structured LEDs have good reliability performance.

【Abstract】 We propose a new method of using conductive glue to agglutinate GaAs based AlGaInP light emitting diodes (LEDs) onto silicon substrate,and the absorbing GaAs layer is subsequently removed by grinding and selective wet etching.It was found that AlGaInP-Si glue agglutinated LEDs have larger saturation current and luminous intensity than the conventional LEDs working at the same injected current.The luminous intensity of the new device is as much as 1007.4 mcd at a saturation current of 125 mA without being encapsulated,while the conventional LEDs only have 266.2 mcd at a saturation current of 105 mA.The luminescence intensity is also found to increase by about 3.2% after working at 50 mA for 768 h.This means that the new structured LEDs have good reliability performance.

【基金】 Project supported by the National High Technology Research and Development Program of China (Grant No. 2006AA03A121);the National Basic Research Program of China (Grant No. 2006CB604900)
  • 【文献出处】 Chinese Physics B ,中国物理B , 编辑部邮箱 ,2011年08期
  • 【分类号】TN312.8
  • 【被引频次】1
  • 【下载频次】35
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