【摘要】 文章研究了在PCB基材上化学镀Ni-P合金层用于埋置电阻的工艺方法。基于埋入电阻在挠性及刚性PCB板中的应用,分别研究了Ni-P合金在无卤的FR-4、无卤的PI两种PCB基材上镀层厚度与试验时间之间的关系,初步得出了在两种不同基材上化学沉积Ni-P合金的规律,该规律对后期的试验具有重要的指导作用。更多还原

【Abstract】 The process method of electroless plating Ni-P alloy layer used to embedded resistor on PCB substrate was studied.The relation of thickness with time for electroless plating Ni-P alloy layer on two different substrates of halogen-free FR-4 and halogen-free PI was also discussed.Some experimental rules about electroless plating Ni-P alloy on two different substrates have been obtained,which have certain guiding role to the following experiments.更多还原