【摘要】 介绍了发光二极管(LED)的特点、封装形式的发展及对封装材料的性能要求,指出了现有LED封装材料环氧树脂的缺陷,分析了有机硅封装材料的特点,综述了功率型LED封装用有机硅材料的研究进展。更多还原

【Abstract】 The characteristics of the light emitting diode(LED),the development of the encapsulation technology and the requirements for the encapsulation materials were introduced.The disadvantages of epoxy resin used in LED encapsulation were pointed out.The characteristics of the silicone encapsulation materials were analyzed,then the latest research development of silicone materials used for high-power LED encapsulation were reviewed in details.更多还原