【摘要】 在氮气气氛下、保温10min、948～1098K利用活性金属铸接方法制备铝/氮化铝陶瓷基板,用力学试验机、扫描电子显微镜、高温金相光学显微镜和原子力显微镜对铝/氮化铝陶瓷的结合强度和机理进行研究.结合温度低于973K时,铝和氮化铝陶瓷之间的剥离强度随结合温度升高线性增大,当结合温度超过973K时,结合温度对强度影响很小,铝和氮化铝陶瓷之间的结合强度约为49N/mm,铝和氮化铝陶瓷之间的结合为物理湿润和化学反应湿润共同作用.更多还原

【Abstract】 Al/AlN substrate was produced by die casting bonding process with the bonding time of 10 min in the range of 948K to 1098K under N2 atmosphere.The bonding mechanism and strength were investigated by mechanic testing equipment,high-temperature metallographic microscope,AFM and SEM.When the bonding temperature is increased below 973K,the peeling strength of the aluminium with the AlN ceramic substrate rises linearly.While the bonding temperature is above 973K,the temperature influence on the bonding strength is not significant.The peeling strength of the pure aluminium with the AlN ceramic substrate is about 49N/mm.The bonding mechanism between aluminium and aluminium nitride can be ascribed to physical and chemical reaction wetting.更多还原