【摘要】 通过基板级跌落实验、热循环测试实验以及焊点一维热应力计算等方法,研究了填充胶封装BGA焊点的可靠性。结果表明,底部填充胶封装BGA焊点可增强基板的抗跌落性能、耐热循环性能,提高基板的可靠性;添加填充剂的底部填充胶BGA封装焊点比未添加填充剂的底部填充胶BGA封装焊点的抗跌落能力要强;选用添加填充剂的底部填充胶且热膨胀系数低的材料,可以显著减少BGA封装焊点的内热应力,焊点有较佳的耐热循环能力。更多还原

【Abstract】 Based on the level drop experiment,solder joints thermal cycling test and one-dimensional thermal stress calculation,the reliability of underfill BGA package lead-free solder joint was studied.The results show that underfill BGA solder joints can strengthen the substrate’s performance of anti-dropping and the heat resisting cycle as well as the reliability.The underfilled plastic packaging BGA solder joints performance of anti-dropping are stronger than joints without filling agent.Choosing low thermal expansion coefficient material to underfill the joint,the internal thermal stress of joints can be reduced pronouncedly,with a better heat resisting cycle performance.更多还原