【摘要】 为了获得低成本和性能良好的无铅焊料,本文对Sn-X-Cu-Ni焊料的微观组织及物相成分、熔点、润湿性和抗拉强度进行了分析研究。结果表明,Sn-X-Cu-Ni焊料中主要由βSn、XSn化合物和Cu6Sn5化合物组成,Sn-X-Cu-Ni焊料合金的熔点随X含量增加而增高;当X的含量为4.5%时,焊料的铺展性最好,抗拉强度也最大。更多还原

【Abstract】 In order to obtain the low cost and the good performance of lead-free solder.The microstructure,ingredients,melting point,wettability and tensile strength of Sn-X-Cu-Ni lead-free solder were studied.The results show that Sn-X-Cu-Ni lead-free solder is mainly composed of βSn,XSn compound and Cu6Sn5 compound,the Sn-X-Cu-Ni solder alloy’s melting point increases along with X content inereasing;When X content is 4.5%,the solder spread-eagle is best,the tensile strength is also biggest.更多还原