【摘要】 采用聚氨酯弹性体(PU)为聚合物基体,超高介电常数的酞菁铜齐聚物(CuPc)为添加物,通过化学方法将CuPc接到PU链上,制备高介电常数复合材料。TEM结果显示,CuPc在PU中的分散性大大改善,颗粒尺寸约为20nm,约为CuPc和PU简单共混中CuPc粒径的1/25。颗粒尺寸的减小大大增强了复合体系中界面交换耦合效应,极大增加了复合材料的介电常数。在100Hz时,CuPc含量为15wt%的复合材料,介电常数高达380左右。更多还原

【Abstract】 In this study,a high dielectric constant nanocomposite is developed using polyureth-ane(PU) as matrix and Chemically modified high dielectric constant organic semiconductor-cop-per phthalocyanine oligomer(CuPc)-as filler.From transmission electron microscope(TEM) results,the size of CuPc in CuPc-g-PU particles was about 20nm,which was less than 1/25 the size of CuPc in CuPc/PU.At 100Hz,the nanocomposite film with 15wt% CuPc can realize a dielectric constant of 380.The significant enhancement of the dielectric constant can be attributed to the remarkably strengthened exchange coupling effect which was caused by the improved dispelrsibi-lity and greatly reduced the particle size of CuPc in the nanocomposite.更多还原