【摘要】 本文采用聚氨酯抛光盘和绒布抛光垫对铜衬底进行超精密抛光工艺研究,对铜衬底的表面粗糙度、材料去除率以及铜衬底表面组织结构变化过程进行了研究,并讨论了铜衬底在超精密抛光时,不同抛光条件对其表面粗糙度和材料去除率的影响,以及抛光压力对铜衬底的表面形成过程的影响。结果表明,采用聚氨酯抛光盘和绒布抛光垫可以消除划痕,抛光后的铜衬底表面粗糙度可达Ra6 nm。更多还原

【Abstract】 The ultraprecision lapping technology for the copper substrate employing polyurethane polishing pad and flannel pad is studied.The surface roughness,material removal rate and changing process of surface microstructure of copper substrates are discussed.The effect of different lapping parameters on the surface roughness and material removal rate as well as the influence of lapping pressure on copper substrate surface formation during the ultraprecision lapping process are discussed.The experiment results showed that the surface scratches could be eliminated by employing polyurethane polishing pad and flannel pad,and an extremely smooth surface of copper substrate with roughness Ra 6 nm was obtained in the final finishing lapping process.更多还原