节点文献
热分析在光电模块可靠性设计上的应用研究
Application of Thermal Analysis on Reliability Design of Optoelectronic Modules
【摘要】 元器件计数法是目前国内外针对光电模块可靠性设计的通用方法,为了改善没有成熟光电模块产品就无法有效进行可靠性预计的问题,在产品设计阶段通过运用流体仿真分析软件以XFP(10 G小型可插拔)模块为例模拟分析其在不同温度条件下的工作状态。完成了XFP模块的热分析,给出了XFP模块可靠性设计的优化办法,得到了XFP模块可靠性预计的具体量化结果,实现了在设计阶段针对光电模块产品可靠性进行定量分析。
【Abstract】 Components of counting method is the general method of the reliability design of optoelectronic modules at home and abroad.In order to improve the problem that no mature optoelectronic modules the reliability prediction can not be effectively carried out,in product design stage by using Flow Simulation softwar,and working status of XFP(10G small form factor pluggable) module,for example,is simulation analyzed under different temperature conditions.The thermal analysis of XFP module is finished,and the optimization approach of the reliability design of XFP module is given.Then the specifically quantified of the reliability prediction of XFP module and is expected,the quantitative analysis of reliability for optoelectronic modules in the design phase is achieved.
【Key words】 optical communications; reliability prediction; thermal analysis; XFP module;
- 【文献出处】 激光与光电子学进展 ,Laser & Optoelectronics Progress , 编辑部邮箱 ,2011年07期
- 【分类号】TN15
- 【被引频次】3
- 【下载频次】142