【摘要】 本文研究报道了Pyrex7740玻璃湿法腐蚀通孔技术。将四寸硅玻璃键合圆片的玻璃衬底减薄,并在玻璃上分别制备PECVD SiC、W/Au和PECVD多晶硅三种不同掩膜及其开口,最终利用40%HF腐蚀实现玻璃通孔。整个工艺过程与IC工艺兼容,并可进行圆片级批量加工。观察并研究纵向和横向腐蚀过程和通孔形貌,对比三种不同腐蚀掩膜掩蔽效果。本文研究结果为圆片级密封封装及其它MEMS器件奠定了基础。更多还原

【Abstract】 This paper reports fabrication of via - hole on Pyrex7740 glass wafer by wet - etching technique. Firstly silicon and glass wafers were anodically bonded together and glass wafer was thinned to about 100? m.Then three kinds of materials(such as PECVD SiC and Poly -Si and W/Au) were prepared and patterned as hard - mask respectively.Lastly via - holes were realized by 40%HF wet - etching on glass wafer.This process is very simple,low price and IC compatible.The vertical and lateral etching processes were studied and profile of the via - hole was observed.The masking impact of three kinds of hard - masks was compared.This work can be useful for the fabrication of some MEMS device, especially wafer - level vacuum package.更多还原