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Sn3.8Ag0.7Cu和Sn37Pb焊点界面显微结构研究

Interfacial microstructures of Sn3.8Ag0.7Cu and Sn37Pb joints

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【Author】 LIU Ping1,2,YAO Pei3,GU Xiao-long1,ZHAO Xin-bing2,LIU Xiao-gang1(1.Zhejiang Province Key Laboratory of soldering & Brazing Materials and Technology,Zhejiang MetallurgicalResearch Institute,Hangzhou Zhejiang 310011;2.Department of Materials Science and Engineering,Zhejiang University,Hangzhou Zhejiang 310027;3.College of Material Science andEngineering,Tianjin University,Tianjin 300072,China)

【机构】浙江省冶金研究院有限公司浙江省钎焊材料与技术重点实验室；浙江大学材料科学与工程学系；天津大学材料科学与工程学院；

【摘要】利用扫描电子显微镜(SEM)和透射电子显微镜(TEM)研究了Sn3.8Ag0.7Cu(Sn37Pb)/Cu焊点在时效过程中的界面金属间化合物(IMC)形貌和成份。结果表明:150℃高温时效50、100、200、500h后,Sn3.8Ag0.7Cu(Sn37Pb)/Cu焊点界面IMC尺寸和厚度增加明显,IMC颗粒间的沟槽越来越小。50h时效后界面出现双层IMC结构,靠近焊料的上层为Cu6Sn5,邻近基板的下层为Cu3Sn。之后利用透射电镜观察了Sn37Pb/Ni和Sn3.8Ag0.7Cu/Ni样品焊点界面,结果显示,焊点界面清晰,IMC晶粒明显。更多还原

【Abstract】 The present work studied the IMC morphology and composition at the interface of aged Sn3.8Ag0.7Cu(Sn37Pb)/Cu joints by SEM and TEM.It was found that IMC layer thickness and grain size increased with the increase of aging time.After 50 h aging,Sn3.8Ag0.7Cu(Sn37Pb) /Cu joints exhibited a duplex intermetallic compound structure;i.e.a layer of Cu6 Sn5 close to the solder and a layer of Cu3 Sn adjacent to the Cu substrate.Finally the interface of FIB prepared Sn37Pb/Ni and Sn3.8Ag0.7Cu/Ni sample was examined under TEM.TEM images showed that the interfacial structure and IMC grain were evident.更多还原

【关键词】 Sn3.8Ag0.7Cu； Sn37Pb；金属间化合物；扫描电镜(SEM)；透射电镜(TEM)；
【Key words】 Sn3.8Ag0.7Cu； Sn37Pb； IMC； SEM； TEM；

【基金】浙江省自然科学基金资助项目(No.Y4100809)

【文献出处】电子显微学报 ,Journal of Chinese Electron Microscopy Society , 编辑部邮箱 ,2011年02期

【分类号】TG401
【被引频次】4
【下载频次】158

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