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回流次数对Sn3.8Ag0.7Cu-xNi/Ni焊点的影响

Effects of multiple reflows on Sn3.8Ag0.7Cu-xNi/Ni solder joints

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【Author】 LIU Ping1,2,GU Xiaolong1,YAO Pei3,ZHAO Xinbing2,LIU Xiaogang1(1.Zhejiang Province Key Laboratory of soldering & Brazing Materials and Technology,Zhejiang Metallurgical Research Institute,Hangzhou 310011,China;2.Department of Materials Science and Engineering,Zhejiang University,Hangzhou 310027,China;3.College of Material Science and Engineering,Tianjin University,Tianjin 300072,China)

【机构】浙江省冶金研究院有限公司浙江省钎焊材料与技术重点实验室；浙江大学材料科学与工程学系；天津大学材料科学与工程学院；

【摘要】研究了复合无铅焊料Sn3.8Ag0.7Cu-xNi(x=0.5,1.0,2.0)与Au/Ni/Cu焊盘在不同回流次数下形成的焊点的性能。结果表明,Ni颗粒增强的复合焊料具有良好的润湿性能,熔点小于222℃;x为0.5的焊料界面IMC由针状(CuNi)6Sn5演化为双层IMC,即多面体状化合物(CuNi)6Sn5和回飞棒状(NiCu)3Sn4。当x超过1时,焊点界面只有单层回飞棒状(NiCu)3Sn4生成。并且,复合焊料焊点的剪切强度高于非复合焊料。更多还原

【Abstract】 The composite lead-free solders Sn3.8Ag0.7Cu-xNi(x=0.5,1.0,2.0) were produced,the properties of the solders joints with Au/Ni/Cu pads were studied in different reflow numbers.Results show that the composites solders have optimal wetting ability compared with that of without Ni-adding.The melting point is less than 222 ℃.The intermetallic compounds(IMC) alters from the needle-like(CuNi)6Sn5 of the joint without Ni-adding to dual layers of polyhedron(CuNi)6Sn5 and boomerang shape(NiCu)3Sn4 when x=0.5,and only boomerang shape(NiCu)3Sn4 is formed at the interface between the composite solder and Ni layer when x exceeds 1.0.The shear strength of solder joints is higher than that without Ni-adding.更多还原

【关键词】复合无铅焊料； Sn3.8Ag0.7Cu；金属间化合物；回流；
【Key words】 composite lead-free solder； Sn3.8Ag0.7Cu； intermetallic compound； reflow；

【基金】浙江省2010年自然科学基金资助项目(No.Y4100809)

【文献出处】电子元件与材料 ,Electronic Components and Materials , 编辑部邮箱 ,2011年06期

【分类号】TG425.1
【被引频次】6
【下载频次】129

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