【摘要】 利用扫描电镜、能谱分析仪对Sn0.3Ag0.7Cu-xLa/Cu(x=0～0.25)和Ni界面金属间化合物(IMC)形成及长大规律进行了研究。结果表明:微量La的添加使钎焊与时效后焊点/Cu界面生成的Cu6Sn5晶粒明显细化,当x超过0.10时,Cu6Sn5晶粒的上方出现大量的粒状Ag3Sn,晶粒表面粗化并出现孔洞。x为0.07的焊点/Ni的IMC厚度变化在时效过程中比较稳定,且超过300 h时效后,其IMC厚度最小,因此,La的最佳质量分数应为0.07%。更多还原

【Abstract】 The formation and growth of intermetallic compounds(IMC) for Sn0.3Ag0.7Cu-xLa/Cu(x = 0-0.25) and Ni were studied with the scanning electron microscope and the energy dispersive X-ray detector.The results indicate that the grain size of Cu6Sn5 in the soldering point/Cu interface is obviously refined with La addition after reflowing and aging.When x surpasses 0.10,numerous grains of Ag3Sn appear on the top of Cu6Sn5 grain,and the surface of Cu6Sn5 becomes coarsing and emerges many holes.When x is 0.07,the thickness of IMC changes relatively stable with increment of the aging time and is minimum after 300 h aging.The optimum addition of w(La) is 0.07%.更多还原