【摘要】 利用非平衡多靶溅射沉积法在不同脉冲偏压、沉积速率下制备了Ti-Nb-Ni薄膜,用X射线衍射(XRD)、扫描电镜(SEM)、透射电子显微镜(TEM)和电化学极化试验分析了薄膜结构和抗腐蚀性能。结果表明,在0V偏压下,当Ti:Nb:Ni沉积速率比为3:1.5:1.5时,为晶化薄膜;而当Ti沉积速率的控制电流在5～7A范围内,Nb、Ni沉积速率不变时,为非晶薄膜。对于沉积速率比为5:1.5:1.5的薄膜,当偏压从0V增加到–2000V时,薄膜组织的演化过程为非晶-弥散小晶粒-致密小晶粒-大颗粒晶粒。电化学极化试验表明,利用非晶化和晶化复合工艺获得的Ti-Nb-Ni薄膜具有更好的耐腐蚀性能。更多还原

【Abstract】 Ti-Nb-Ni alloy films were prepared on uranium substrate by unbalanced twin target magnetron sputtering at different bias voltages and deposition rates. The microstructure and corrosion resistance of the films were investigated by X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM) and electrochemical polarization experiments. The results show that the Ti-Nb-Ni films are crystal when the deposition rate ratio of Ti:Nb:Ni is 3:1.5:1.5 at 0 V bias voltage. But the Ti-Nb-Ni films are amorphous when the control current of Ti deposition rates is from 5 A to 7 A with unchanged deposition rates of Nb and Ni. The microstructure evolution of the alloy films is as following: amorphous→dispersed small grains→dense small grains→large grains with the bias voltage increasing from 0 to –2000 V. The electrochemical polarization experiments indicate that the films prepared by the compounding techniques of non-crystallization and crystallization have excellent corrosion resistance.更多还原