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电流密度对紫铜基体电沉积Fe-W合金的影响
Effect of Current Density on Electrodeposited Fe-W Alloy Coating on Red Copper
【摘要】 针对目前Fe-W合金镀层中W含量较低致使镀层硬度不高的问题,通过电沉积法在铜表面沉积Fe-W合金,获得了一种W含量较高、表面致密且高硬度的非晶合金涂层。用SEM,XRD和EDS表征了镀层形貌、结构和成分,并测定了镀层的显微硬度。结果表明:不同电流密度下镀层均为非晶结构,形貌为圆球状颗粒;镀层厚10~100μm;随着电流密度增大,镀层中孔隙增多,其中W质量分数达57%~61%;电流密度为10 A/dm2时,镀层中孔隙较少,电流效率最高,显微硬度达最大值681 HV,此后随电流密度增大镀层显微硬度降低。
【Abstract】 Compact Fe-W amorphous alloy coating with a high content of W and high hardness was electrodeposited on copper surface.The morphology,microstructure and composition of the alloy coating were analyzed by means of scanning electron microscopy,X-ray diffraction and energy dispersive spectrometry,and the microhardness of the Fe-W alloy coating was also determined.It was found that the Fe-W alloy coatings obtained under different current densities,with thicknesses of 10~100 μm,had amorphous structure and consisted of spherical grains.The amounts of pores in the alloy coatings increased with the increase of current density,and the contents of W in the coatings reached 57%~61%(mass fraction).The highest current efficiency was reached at a current density of 10 A/dm2,and corresponding Fe-W alloy coating contained less amount of pores and had the highest microhardness of 681 HV.Beyond a current density of 10 A/dm2,the microhardness of the alloy coating decreased with increasing current density.
【Key words】 Fe-W coating; electrodeposition; red copper; amorphous alloy; microhardness;
- 【文献出处】 材料保护 ,Materials Protection , 编辑部邮箱 ,2011年01期
- 【分类号】TQ153.2
- 【被引频次】2
- 【下载频次】152