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水平与垂直流动对微电铸镀层均匀性的影响
Influence of horizontal and vertical flow pattern on coating uniformity inside micro-structures during electrodeposition
【摘要】 利用有限元分析软件FLUENT对微电铸镀层均匀性进行了分析。对当物质传递成为金属沉积的控制步骤时,进行铸层均匀性的数值模拟,研究不同流动方式对均匀性的影响。模拟结果表明:当物质传递成为控制步骤时,增强对流—扩散虽然有利于物质传输,但均匀搅拌更有利于镀层均匀性;垂直流动相对于水平流动因离子到达阴极表面各处的传质阻力相同,故能有效改善镀层形貌的均匀性。
【Abstract】 Micro-electroforming uniformity is analyzed using FLUENT software.Effects of different flow pattern on uniformity is studied.It is simulated when the mass transfer turns into the control step.The results of simulations show that when the uniformity is controlled mainly by mass transfer,though enhancing convection-diffusion is conducive to the mass transfer,mixing is more beneficial to the coating uniformity.Relative to the horizontal flow,vertical flow can effectively improve coating uniformity due to the same mass transfer resistance.
【Key words】 micro-electroforming; convective-diffusive mass transfer; mass transfer resistance; flow pattern;
- 【文献出处】 传感器与微系统 ,Transducer and Microsystem Technologies , 编辑部邮箱 ,2011年06期
- 【分类号】TQ153
- 【被引频次】11
- 【下载频次】245