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高压GaAs微型太阳电池阵列的制备

Fabrication of High Voltage GaAs Micro-Solar Cell Arrays

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【作者】 白一鸣陈诺夫王彦硕王俊黄添懋汪宇张兴旺尹志刚张汉吴金良姚建曦

【Author】 Bai Yiming1,Chen Nuofu1,2a,Wang Yanshuo2a,Wang Jun2b,Huang Tianmao2a,Wang Yu2a,Zhang Xingwang2a,Yin Zhigang2a,Zhang Han2a,Wu Jinliang2a,Yao Jianxi1 (1.New and Renewable Energy of Beijing Key Laboratory,North China Electric Power University,Beijing 102206,China;2.a.Key Laboratory of Semiconductor Materials Science;b.National Engineering Research Center for Optoelectronic Devices,Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China)

【机构】 华北电力大学新能源与可再生能源北京市重点实验室中国科学院半导体研究所材料重点实验室中国科学院光电子器件国家工程中心

【摘要】 为了提高GaAs微型太阳电池的输出性能,对微型太阳电池阵列的主要工艺进行了研究和改进。通过对帽层、背电极层和台面的选择性/非选择性湿法腐蚀工艺的探索,实现了对最佳腐蚀液的配比、腐蚀时间和温度的控制。采用侧壁钝化工艺和聚酰亚氨(PI)/SiO2/TiAu/SiO2新型互连结构,不仅确保了电池单元之间有效的隔离和互连,而且极大地降低了侧壁载流子复合电流,同时这种新型互连结构可有效防止由于衬底光敏现象引起的漏电流。经过上述器件工艺改进,获得了高集成度GaAs微型太阳电池阵列。电流-电压(JSC-VOC)测试结果显示,器件的开路电压达到84.2V,填充因子为57%。

【Abstract】 The main fabrication processes were investigated and improved in order to improve the output performance of GaAs micro-solar cells.The selective/unselective etching was carried out for the cap layer,back cathode layer and mesa of the cell,and the control of the optimum et-ching solution ratio,etching time and temperature was obtained by exploring the wet etching process.The sidewall passivation process and the novel interconnected structure of polymide(PI)/SiO2/TiAu/SiO2 were proposed to ensure the effective insulation and interconnection be-tween the cell units,greatly reduce the carriers recombination current of the sidewall and prevent the substrate leakage current due to the photosensitivity of the SI-GaAs substrate.By improving the fabrication technology mentioned above,the GaAs micro-solar cell array with high integration level was fabricated.The result of the current-voltage measurement shows that the open-circuit voltage of 84 V and the fill factor of 57% were achieved.

【基金】 国家自然科学基金资助项目(61006150,61076051);国家重点基础研究发展计划(973计划)资助项目(2010CB933800);北京市自然基金资助项目(2102042);中央高校基本科研业务费专项资金资助项目(10QG24)
  • 【文献出处】 微纳电子技术 ,Micronanoelectronic Technology , 编辑部邮箱 ,2011年04期
  • 【分类号】TM914.4
  • 【下载频次】138
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