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镀膜装置蒸发源发射形态与膜厚分布

Emission form of evaporator sources for coating system and film thickness distribution

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【作者】 徐树深梅丽文张建光

【Author】 XU Shu-shen1,MEI Li-wen1,ZHANG Jian-guang2(1.Wenzhou Research Institute of Pump and Valve Engineering of Lanzhou University of Technology, Wenzhou 325105,China;2.Zhejiang Haoshida Valve Industry Co.LTD,Wenzhou 325025,China)

【机构】 兰州理工大学温州泵阀工程研究院浙江好事达阀业有限公司

【摘要】 蒸发源是真空镀膜装置中一个非常重要的部件。在多个蒸发源共存的装置中,如何在设计中正确选择蒸发源与蒸发源、蒸发源与基片之间的距离就显得尤为重要,它直接关系到基板涂层均匀性。本篇文章根据蒸发源与基片之间的物理联系入手,分析基片--蒸发源距离对基片涂层均匀性的影响,进而对蒸发源与蒸发源、蒸发源与基片之间距离的确定,提出了自己的一些观点和看法。

【Abstract】 Evaporator source is integral to a vacuum coating system.For a coating system involving several evaporator sources,how to choose the distances between different sources and between the sources and substrate are very important in design,since they relate directly to the homogeneity of coating on substrate.In view of the physical relation between evaporator source and substrate,the effect of the source-substrate distance on coating homogeneity is analyzed so as to determine the distances between different sources and between the sources and substrate.Some suggestions are offered in this regard.

【关键词】 真空镀膜基片蒸发源距离
【Key words】 vacuum coatingsubstrateevaporation sourcedistance
  • 【分类号】TB43
  • 【被引频次】6
  • 【下载频次】372
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