【摘要】 金刚石热管理材料已成为目前电子工业理想的散热材料之一。文章综述了金刚石热管理材料的研究现状和发展趋势,分析了影响金刚石热管理材料热导率的相关因素。结合复合材料热导率模型和实验研究,探讨金刚石-金属界面导热机制,提出了形成粘结强度高、界面热阻低的金刚石-金刚石有效导热通道有助于获得高导热封装材料。金刚石热管理材料在电子领域的应用前景广阔。更多还原

【Abstract】 Ongoing trends of miniaturization of electronic devices have made diamond composite an open and challenging area for researchers.Research status and development of diamond composites for thermal management are illustrated and factors relating to thermal conductivity are analyzed.According to thermal conductivity models and experimental study,the heat conduction mechanisms across the metal-diamond interface are discussed,and conclusions that effectively conductive passages with high strength and low thermal resistance interfaces in the composites are helpful for excellent properties is deduced.Therefore,diamond thermal management materials are promising in electronic industry application.更多还原