节点文献
Sn-Zn-Al-P系无铅焊料物理性能研究
Study on Physical Properties of Sn-Zn-Al-P Lead-free Solder
【摘要】 在Sn-Zn系无铅焊料的基础上,通过添加合金元素Al和P制备出不同成分的无铅焊料,研究了其无铅焊料的物理性能。结果表明:通过加入适量合金元素Al和P的Sn-Zn-Al-P系无铅焊料在基本上不影焊料响熔点的前提下,可以减小密度,降低成本,提高其导电性能和润湿性。
【Abstract】 The different weight percentages of Sn-Zn-Al-P lead-free solders were processed by adding alloying elements Al and P.The physical properties of Sn-Zn-Al-P lead-free solders were researched.The results show that appropriate amount of alloying elements Al and P of Sn-Zn-Al-P lead-free solders can reduce the density to cut the costs and improve conductive property and wetting ability without the effect of melting point of Sn-Zn-Al-P lead-free solders.
【关键词】 无铅焊料;
熔点;
导电性能;
润湿性;
【Key words】 lead-free solder; melting point; conductive property; wetting ability;
【Key words】 lead-free solder; melting point; conductive property; wetting ability;
【基金】 上海市重点学科建设项目资助(B503)
- 【文献出处】 热加工工艺 ,Hot Working Technology , 编辑部邮箱 ,2010年01期
- 【分类号】TG425
- 【被引频次】5
- 【下载频次】190