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铜中间层对铍/HR-1不锈钢热静压扩散连接组织性能的影响
Microstructure and properties of hot pressing bonding on Be/HR-1 stainless steel with Cu as interlayer
【摘要】 利用金相显微镜、扫描电镜(SEM)及能谱仪(EDS)、俄歇电子能谱(AES)、X射线衍射仪(XRD)、显微硬度计和材料试验机,分析了铜作中间过渡层材料时,热静压扩散连接铍/HR-1不锈钢接头的组织结构、微区成分和性能,探讨了扩散区成分,组织结构与性能的关系。研究表明:扩散迁移后的原Be/Cu界面是整个扩散连接区的最弱处,是试样的断裂位置;用铜作过渡材料后,较有效地阻碍了铍与不锈钢元素金属间化合物的生成,提高了扩散连接接头的性能。
【Abstract】 Microstructure,elements distribution and mechanical properties of Be /HR-1 stainless steel diffusion welds with copper as interlayer were analyzed by means of optical microscopy,scanning electron microscopy(SEM),Auger electron spectroscopy,energy dispersive spectrometer(EDS),X-ray diffraction(XRD),micro-hardness and tensile tests.The relationship between composition and microstructure and properties was discussed.The results show that the interface between Be and Cu after diffusion bonding is the site of fracture.The formation of intermetallic compounds between beryllium and element in stainless steel is avoided effectively to improve the diffusion welding strength as copper is used as interlayer material,and properties of the joints is improved.
【Key words】 beryllium; HR-1 stainless steel; diffusion bonding; microstructure; properties;
- 【文献出处】 材料热处理学报 ,Transactions of Materials and Heat Treatment , 编辑部邮箱 ,2010年11期
- 【分类号】TG453.9
- 【被引频次】1
- 【下载频次】132