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适用于厚膜剥离的图形反转双层胶光刻技术
Image-reversal dual layer photolithography technology for thick film lift-off
【摘要】 介绍了一种适用于厚膜剥离的图形反转双层胶光刻技术,采用图形反转胶和正型光刻胶,选择合适的光刻工艺形成了光刻胶"倒梯形"的剖面结构,可以成功剥离与胶层厚度相同的膜层,厚度可达13μm。同时对一些技术机理和关键工艺条件进行了讨论。
【Abstract】 The paper introduced the image-reversal dual layer photolithography technology that is suitable for thick film lift-off.The reverse trapeziform shape of resist was made by coating a image-reversal resist layer on a thicker positive resist layer,this technology can achieve the 13 μm thick film lift-off without high edge.And some mechanism problems are discussed.
【关键词】 图形反转;
双层光刻胶;
厚膜剥离;
倒梯形;
【Key words】 image-reversal; dual layer resist; thick film lift-off; reverse trapeziform shape;
【Key words】 image-reversal; dual layer resist; thick film lift-off; reverse trapeziform shape;
- 【文献出处】 激光与红外 ,Laser & Infrared , 编辑部邮箱 ,2010年03期
- 【分类号】TN205
- 【被引频次】5
- 【下载频次】537