【摘要】 利用阵列微电极技术测量了金属铜的自腐蚀电位、阻抗及表面腐蚀产物膜层载流子密度,并结合扫描电子显微镜,研究了Nd3+对金属铜在3.5%(w)NaCl溶液中腐蚀电化学行为的影响.结果表明,加入Nd3+使得金属铜表面生成的腐蚀产物膜层的形貌及结构发生了变化,腐蚀产物膜层变薄,腐蚀产物由片状结构转变为粒状结构,颗粒均匀分散分布;Nd3+的存在使得金属铜表面各区域的电位方差由0.034下降为0.026,阻抗标准方差由32805下降为6940,电位及阻抗分布趋于均匀化,有利于抑制局部腐蚀的发生;并且加入Nd3+将造成金属铜表面绝大部分区域腐蚀产物膜层的半导体类型由n型转变为p型,表面腐蚀产物膜层载流子密度标准方差由1.89×1017上升为4.10×1017,载流子密度分布趋于不均匀.更多还原

【Abstract】 The effect of Nd3+ on corrosion electrochemical behavior of copper in 3.5% (w) NaCl solution was analyzed by microelectrode array and scanning electron microscopy. The corrosion potential distribution, the impedance distribution and the carrier density distribution of corrosion product film on surface of copper were investigated. The results show that with the addition of Nd3+, morphology and structure of corrosion product film were changed, the film became thin, the structure of corrosion product was changed from sheet structure to granular structure and corrosion product particles were well dispersed. The presence of Nd3+ led the variance of corrosion potential decreased from 0.034 to 0.026 and the variance of impedance decreased from 32805 to 6940. The corrosion potential and impedance distribution tended to homogenization, which indicates that Nd3+ could restrain the localized corrosion. The type of semiconductor of corrosion product film on the mostly surface of copper was changed from n-type to p-type with the addition of Nd3+. At the same time, the variance of carrier density of corrosion product film increased from 1.89×1017 to 4.10×1017, the carrier density of corrosion product film on surface of copper tended to inhomogeneous when Nd3+ was added.更多还原