节点文献

PI/SiO2复合薄膜导热性能理论预测和实验验证

Theoretical and Experimental Evaluation of Thermal Conductivity of Polyimide/Silica Composite Films

  • 推荐 CAJ下载
  • PDF下载
  • 不支持迅雷等下载工具,请取消加速工具后下载。

【作者】 蔡岸杨莉萍雒彩云陈江平奚同庚

【Author】 CAI An1,2,YANG Li-ping1,CHEN Jiang-ping2,XI Tong-geng1(1.Shanghai Institute of Ceramics,Chinese Academy of Sciences(SICCAS) Shanghai 200050,China;2.Shanghai Jiao Tong University,Shanghai 200240,China)

【机构】 中国科学院上海硅酸盐研究所上海交通大学

【摘要】 在对复合材料导热性能的多种预测模型进行理论分析和对比研究的基础上,应用自行研制的亚微米/微米薄膜材料热性能测试仪和差示扫描量热仪(DSC)对聚酰亚胺(PI)及其复合薄膜PI/SiO2的热扩散率和比热进行了实验研究,通过导热系数实测值和模型预测值的对比,显示预测模型中考虑填充颗粒尺寸分布的Sorin模型预测值与实验值更为吻合。理论预测和实验研究均表明,在20~160℃温区内,PI/SiO2的导热系数随着SiO2添加量的增加和温度升高呈现明显增大的趋势。

【Abstract】 Different models for thermal conductivity prediction of composite materials were evaluated and analyzed with experimental values.Laser flash method and differential scanning calorimeter were employed to carry out the measurements of thermal diffusivity and specific heat of polyimide/silica composite films with different silica contents.The thermal conductivity was calculated and compared with prediction and the results show that the Sorin model considering filler size distribution fits better with experimental data.Both prediction and experimental values indicate that thermal conductivity of polyimide/silica composites increases with the increase of silica content,and increases with temperature rise in temperature range 20~160℃.

【基金】 国家自然科学基金资助项目(50706057)
  • 【文献出处】 航空材料学报 ,Journal of Aeronautical Materials , 编辑部邮箱 ,2010年03期
  • 【分类号】TB383.2
  • 【被引频次】8
  • 【下载频次】196
节点文献中: 

本文链接的文献网络图示:

本文的引文网络