【摘要】 研究了P2O5-V2O5-B2O3-ZnO系无铅封接材料,考察了V2O5和B2O3含量对低熔玻璃软化温度、热膨胀系数及热稳定性的影响.结果表明,玻璃的软化点随V2O5含量增加而降低,提高B2O3含量使软化温度先升高后降低,出现硼反常现象.当V2O5和B2O3摩尔含量为15%和8%时,低熔玻璃的软化温度、热膨胀系数及热稳定性能满足低温封接要求,但化学稳定性较差,而添加少量Al2O3和Fe2O3能明显提高低熔玻璃的化学稳定性.优化组成为26.0P2O5-17.3V2O5-7.7B2O3-45.0ZnO-2.0Al2O3-2.0Fe2O3的玻璃转变温度为340℃,热膨胀系数为7.5×10-6℃-1(25～300℃),在90℃的去离子水中恒温10h,失重为0.63mg/cm2,化学稳定性与传统的含铅封接玻璃相当,综合性能基本满足无铅低熔玻璃的要求.更多还原

【Abstract】 A lead-free low melting glass consisting of P2O5,V2O5,B2O3 and ZnO was studied for electronic sealing application.The effects of V2O5 and B2O3 concentrations on the glass softening temperature(Tf),thermal expansion coefficient and thermal stability were investigated.The results showed that Tf decreased with V2O5 concentration increasing,while as the content of B2O3 increased,Tf first increased and then decreased,which appeared boron abnormal phenomenon.When the glass contained 8%(mol) V2O5 and 15%(mol) B2O3,Tf,thermal expansion coefficient and thermal stability could meet the requirements,but the chemical stability of the glass was poor.But addition of small amounts of Al2O3 and Fe2O3 could greatly improve the chemical stability.Consequently,a glass with molar percentage composition of 26.0P2O5-17.3V2O5-7.7B2O3-45.0ZnO-2.0Al2O3-2.0Fe2O3 with a low transition temperature of 340℃,a thermal expansion coefficient of 7.5×10-6 ℃-1(25～300℃),and a weight loss of 0.63 mg/cm2 after immersing in 90℃ water for 10 h,was successfully prepared for electronic sealing applications.Its properties were comparable with those of traditional low melting sealing glasses.更多还原