【摘要】 研究了一种微电子器件高温封装用Au-In共晶型中温金基钎料合金,钎料由77%~75%Au和23%~25%In(质量分数)构成,规格为0.03~0.10?,钎料箔带材是采用多层叠加轧制方法制造的。实验结果表明,在保护气氛下,500~520℃无钎剂钎焊,钎料对镀金可伐合金和无氧铜、纯镍、纯银等多种母材具有优良的漫流性和间隙填充性,钎焊接头牢固、钎料箔带材塑性高,应用工艺性能良好。更多还原

【Abstract】 A new type eutectic Au-In mid-temperature solder was investigated for microelectronic device high temperature packaging technology.The solder composition is Au 77%~75%,In 23%~25%.The solder foil strip of 0.03~0.10 ㎜ was fabricated by the multi-layered compound rolling method.The experimental results indicated that the solder alloy used for soldering plated gold kovar alloy and the oxygen-free copper,the pure nickel,the pure silver and other many kinds of parent metals has the fine flowability and the gap filled property at conditions of the protective atmosphere and 500~520℃ the fluxless.The soldering joint is reliable.The solder foil strip has high plasticity and the good technological property for application.更多还原