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香芋脆片的微波加工工艺研究
Research of microwave swelling process on Taro chips
【摘要】 就不同的微波处理对香芋脆片的膨化工艺进行了研究,考察了不同微波炉工作功率、垫棍高度、面胚厚度、面胚扎孔间距等对香芋脆片品质的影响,通过正交试验对微波膨化香芋脆片的工艺进行了优化,得到微波功率为640W、垫棍高度为6mm、辊轧至面胚厚度为1.2mm,成型后在面胚扎孔间距为5mm时,加热20s间歇5s,持续8个周期,可获得高品质的香芋脆片。
【Abstract】 In this paper,the swelling process of microwave on Taro Chips was studied.Different microwave power,the pad stick height,surface embryo thickness,surface spacing of the embryos Zakon to the quality of Taro Chips were also studied.Through the orthogonal test of microwave swelled Taro Chips process,we get the best quality of taro crisps were as following,microwave power 640 W,stick pad height of 6 mm,rolling to the embryo surface thickness 1.2 mm,molding surface after embryo Zakon spacing 5 mm,heated 20 s intermittent 5 s,continued 8 cycles.
- 【文献出处】 广东农业科学 ,Guangdong Agricultural Sciences , 编辑部邮箱 ,2010年02期
- 【分类号】TS255.36
- 【被引频次】8
- 【下载频次】344