【摘要】 在800℃下,分别在20、30、40、50MPa压力下对铍/铜/HR-1不锈钢进行真空热静压扩散连接。利用光学金相、显微硬度计、扫描电镜(SEM)、俄歇电子能谱(AES)和X射线衍射仪(XRD)分析了接头扩散区的微区成分和组织结构;探讨了扩散区成分,组织结构与压力的关系。研究表明:压力的作用将使试样产生动态形变再结晶和扩散性蠕变,也能影响扩散焊区的扩散宽度、晶粒大小和金属间化合物数量;单轴向压力作用下,基材或扩散焊区出现织构;降低铍/铜/HR-l不锈钢接头性能的主要因素是金属间化合物优先沿晶界生成,适当降低压力或缩短热压时间可减少金属间化合物的形成,改善连接性能。更多还原

【Abstract】 Be/Cu/HR-1 stainless steel is bonded at 800℃ by hot pressing under different pressure. Optical microscopy, microhardness tester, scanning electron microscopy (SEM), auger electron spectroscopy(AES) and X-ray diffraction (XRD)were used to study microstructure and elements distribution of the steel at the bonded area. The relationship of composition and microstructure with pressure is discussed. The results show that pressure will lead to dynamic recrystallization and diffusion creep, and also has effect on the width of diffusion bonding zones, sizes of grain and amounts of intermetallic compound at the diffusion bonding zones. Texture is formed in matrix or at diffusion bonding zones under uniaxial pressure. The intermetallic compound formed along grain boundary is a main reason for causing breakdown of the bonding area. By the reducing holding pressure or time, the intermetallic compound can be reduced and the bonding strength can be improved.更多还原