【摘要】 半导体晶圆不断向大直径方向发展,内圆刀具的单片切割方式已经不能满足大直径晶圆的切片要求,随着多线锯切割技术的完善,多线切割机已经是半导体材料切片的主流设备。对砂粒在切割过程中的运动进行了分析,同时对钢线张力、切削进给运动进行了理论分析。更多还原

【Abstract】 The semiconductor crystal wafers develop towards bigger diameter. The inner-diameter slicing of single wafer can’t satisfy the incise demand of the wafers with bigger diameter, so the multi-wire saw has become the main equipment in the field of the semiconductor slicing technology. The movement of the sand grain in the slicing process is analyzed in this article. The tension force of the wire and the feeding movement of the slicing are also analyzed theoretically in the article.更多还原