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非导电胶膜互连的液晶显示屏翘曲模拟

Warpage simulation for LCD interconnected by NCF

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【作者】 张建华袁方张金松

【Author】 ZHANG Jian-hua1,2,YUAN Fang2,ZHANG Jin-song2(1.Key Laboratory of Advanced Display and System Applications of Ministry of Education,Shanghai University,Shanghai 200072,China;2.Collge of Mechatronics Engineering and Automation,Shanghai University,Shanghai 200072,China)

【机构】 上海大学新型显示技术及应用集成教育部重点实验室上海大学机电工程与自动化学院

【摘要】 为研究非导电胶膜封装的液晶显示屏可靠性,用有限元法分析玻璃覆晶模块的温度及应力场.建立玻璃覆晶模块的三维模型,应用热-力耦合分析的顺序耦合法求解热压键合、卸载冷却过程中的模块翘曲和热应力分布.结果表明,热压键合是近稳态的热过程,凸点附近的玻璃基板和芯片温度一致,非导电胶膜在固化过程中吸收热应力、松弛热应变,玻璃覆晶模块的内部温差小、翘曲量小;卸载冷却是非稳态的热过程,模块中各点的温度相差较大,但随时间而逐渐下降并趋于一致,玻璃覆晶模块的内部温差大、热应力大、翘曲量大.减小热压键合过程中的机械载荷和卸载冷却过程中模块的温差,有利于降低液晶显示屏内部的残余热应力及翘曲.

【Abstract】 To study the reliability of the Chip-on-Glass(COG) module interconnected by Non-Conductive-Adhesive(NCF),this paper applied finite element method(FEM) to simulate the fields of temperature and stress in COG.A 3D model of the COG module had been established and a sequence coupled field had been done to calculate the warpage and inner stress.In the thermalcompression bonding stage,the thermal process was a steady state,which produced a low temperature difference in the COG module,while the NCF absorbed and relaxed the thermal stress and strain to weaken warpage.In the cooling stage,the process was non-steady and a significant temperature difference between the interfaces of bump/NCF and NCF/substrate was induced at the beginning.This generated a high thermal stress difference to yield a large warpage.The residual stress and warpage were proportional to the decrease of the mechanical loading in the thermal compression bonding stage and the temperature difference in the cooling stage.

【基金】 国家自然科学基金资助项目(50675130);教育部新世纪优秀人才计划资助项目(NCET070535)
  • 【文献出处】 材料科学与工艺 ,Materials Science and Technology , 编辑部邮箱 ,2010年06期
  • 【分类号】TB383.2
  • 【被引频次】3
  • 【下载频次】154
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