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高NH4Cl质量浓度下电镀Ni-P合金的研究

Study on Electroplating Ni-P Alloy in High NH4Cl Concentration

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【作者】 冯婧朱有兰詹柏林陈颖

【Author】 FENG Jing,ZHU Youlan,ZHAN Bolin,CHEN Ying (Institute of Materials and Energy,Guangdong University of Technology,Guangzhou 510006)

【机构】 广东工业大学材料与能源学院

【摘要】 通过添加适量的添加剂,采用正交试验方法,研究了高氯化铵质量浓度下在Q235钢基体上低温电镀Ni-P合金的工艺参数。实验得出最佳工艺条件为:NiSO4·6H2O 40g/L、NaH2PO2·H2O 30g/L、H3BO3 15g/L、NH4Cl 32g/L、添加剂T1 0.12g/L、添加剂T2 0.03g/L、添加剂T3 0.1g/L、施镀温度45℃、电流密度0.015A/cm2、pH=4。最佳工艺条件下所获镀层的EDS分析表明,镀层由靠近基体部位到镀层表面部位,P质量分数变化情况为6.61%→7.18%→8.73%。随着离基体距离的增大,镀层显微结构由晶态向微晶转化,最后为完全非晶态。

【Abstract】 By adding high concentrations of ammonium chloride and an appropriate amount of additives,the process parameters of electroplating Ni-P alloy plating on Q235 steel substrate are studied at low temperature.The optimal formulation is obtained by orthogonal test:NiSO4·6H2O 40g/L,NaH2PO2·H2O 30g/L,H3BO3 15g/L, NH4Cl 32g/L,additive T1 0.12g/L,additive T2 0.03g/L,additive T3 0.1g/L,plating temperature 45℃,current density 0.015A/cm2,pH=4.EDS analysis of the coating made by optimal formulation indicates:from the part near substrate to the centre,and from the centre to the surface,the weight percentage of P ranges 6.61%→7.18%→8.73%.The microstructure of these coatings change from crystal to microcrystal,and finally to completely amorphous with increasing distance form the substrate.

【关键词】 电镀Ni-P合金镀层正交试验非晶
【Key words】 electroplatingNi-P alloy coatingorthogonal testamorph
【基金】 广东省技术创新项目(粤经贸技术[2005]377)
  • 【分类号】TQ153.2
  • 【被引频次】2
  • 【下载频次】86
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