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微/纳机构抗粘附研究进展

Development of micro/nano-machine anti-adhesion study

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【作者】 岳陆游何兴春丁建宁杨继昌马皓晨

【Author】 YUE Lu-you1,HE Xing-chun1,DING Jian-ning1,2,YANG Ji-chang1,MA Hao-chen1(1.School of Mechanical Engineering,Jiangsu University,Zhenjiang 212013,China;2.School of Mechanical and New Energy Engineering,Changzhou University,Changzhou 213164,China)

【机构】 江苏大学机械工程学院常州大学机械与能源工程学院

【摘要】 粘附现象是微/纳机构中特有的现象,在构件材料强度满足要求的条件下,微/纳机构中的粘附和摩擦是造成其失效的主要原因。如何防止或减轻粘附已成为微/纳机电系统(MEMS/NEMS)领域的研究热点。介绍了微/纳机构中的粘附问题,分析了粘附机理和各种粘附接触模型,说明了表面能法和微凸体积分法防粘附设计微/纳机构的原理,最后阐述了释放干燥工艺、减少实际接触面积和降低表面能等各种抗粘附措施。

【Abstract】 Adhesion is a peculiar phenomenon of micro/nano-machine.When the strength of the component’s material meets the demand,the adhesion and friction in the micro/nano-machines are the main cause of their failure.To overcome or reduce adhesion has become the hotspot in the micro/nano-electromechanical systems(MEMS/NEMS) research field.The adhesion issue in the micro/nano-machines is introduced.The mechanisms of adhesion and various adhensive models used in adhesive contact are analyzed.The micro/nano-machines’ design principle of anti-adhesion using surface energy method and asperity integral method is illustrated.Various anti-adhesion methods such as release dry processes,real contact area reducing,and surface energy reducing,are presented.

【关键词】 微/纳机电系统粘附模型设计
【Key words】 MEMS/NEMSadhesionmodeldesign
  • 【文献出处】 传感器与微系统 ,Transducer and Microsystem Technologies , 编辑部邮箱 ,2010年12期
  • 【分类号】TH703
  • 【被引频次】7
  • 【下载频次】299
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