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Solution-based metal induced crystallization of a-Si
【摘要】 This paper investigates a simplified metal induced crystallization(MIC) of a-Si,named solution-based MIC(S-MIC).The nickel inducing source was formed on a-Si from salt solution dissolved in de-ionized water or ethanol.a-Si thin film was deposited with low pressure chemical vapour deposition or plasma enhanced chemical vapour deposition as precursor material for MIC.It finds that the content of nickel source formed on a-Si can be controlled by solution concentration and dipping time.The dependence of crystallization rate of a-Si on annealing time illustrated that the linear density of nickel source was another critical factor that affects the crystallization of a-Si,besides the diffusion of nickel disilicide.The highest electron Hall mobility of thus prepared S-MIC poly-Si is 45.6 cm2/(V · s).By using this S-MIC poly-Si,thin film transistors and display scan drivers were made,and their characteristics are presented.
【Abstract】 This paper investigates a simplified metal induced crystallization(MIC) of a-Si,named solution-based MIC(S-MIC).The nickel inducing source was formed on a-Si from salt solution dissolved in de-ionized water or ethanol.a-Si thin film was deposited with low pressure chemical vapour deposition or plasma enhanced chemical vapour deposition as precursor material for MIC.It finds that the content of nickel source formed on a-Si can be controlled by solution concentration and dipping time.The dependence of crystallization rate of a-Si on annealing time illustrated that the linear density of nickel source was another critical factor that affects the crystallization of a-Si,besides the diffusion of nickel disilicide.The highest electron Hall mobility of thus prepared S-MIC poly-Si is 45.6 cm2/(V · s).By using this S-MIC poly-Si,thin film transistors and display scan drivers were made,and their characteristics are presented.
【Key words】 Ni-salt source; metal induced crystallization(MIC); poly-Si; TFT;
- 【文献出处】 Chinese Physics B ,中国物理B , 编辑部邮箱 ,2009年03期
- 【分类号】TN304.055
- 【下载频次】8